Bandolier Packaging – Ideal for automated assembly processes.
The connectors are delivered in a continuous strip, enabling smooth O-Pin Jig manipulation and indexation, followed by DBC assembling, Reflow soldering, and final Module release—without manual handling.
This format minimizes downtime and ensures precise positioning every time.
The supply of O-pin already including interface surface connectivity for DBC assembly, permits to manage overall inclination of pin tip (max inclination+- 1º) better in unique process, rather than accumulating errors from sleeve assembly and insertion processes.